
IPC-2581 Webinar: Bridging the Design to Manufacturing, Enabling Digital Transformation
Date: April 22nd, 8:00 pm - 9:30 pm (UTC/GMT+08:00)
IPC-2581C, Generic Requirements for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.
As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled support for rigid flex, embedded components, cavities, coins, attenuation parameters, connector ports, pin polarities, edge plating, countersink/counterbore, square drill, and intended net-shorts.
Ensuring that all related data is in digital form, IPC-2581 represents the method of choice for automation between design and manufacturing, significantly surpassing proprietary and legacy formats.
As a specific highlight, revision C includes the bi-directional DFX data exchange through which feedback between design and manufacturing is conveyed and tracked before manufacturing begins.
Webinar Guest Introduction
Hemant Shah
IPC-2581 Consortium Chair
Former Cadence Group Director for Allegro Products
Dana Korf
Principle Consultant, Korf Consultancy
Former Huawei Chief PCB Technology expert
Any questions, please email to ChuckLi@ipc.org.